New Issue: China’s Zibo Caijin prices RMB 580 million 3.7% credit enhanced bonds due 2026 at par

By William Gullotti

Buffalo, N.Y., Sept. 21 – Zibo Caijin Holding Group Co., Ltd. priced RMB 580 million of 3.7% credit enhanced bonds due 2026 at par, according to a listing notice with an appended offering circular on Thursday.

The bonds feature the benefit of an irrevocable standby letter of credit issued by Postal Savings Bank of China Co., Ltd., Zibo Branch.

DL Securities, China Citic Bank International, Industrial Bank Co., Ltd., Hong Kong Branch, Guotai Junan International, Shenwan Hongyuan (H.K.), ABC International, Shanghai Pudong Development Bank Hong Kong Branch, SPDB International, Bocom International, CEB International, CNCB Capital, CMBC Capital, Carnegie Hill Capital Partners Ltd., Essence International and Zhongtai International are the joint lead managers and joint bookrunners, with DL, China Citic, Industrial Bank and Guotai also acting as joint global coordinators.

Proceeds will be used for replenishing working capital.

Listing for the Regulation S bonds is expected on the Hong Kong Exchange effective Sept. 21.

The issuer is a financial and investment holding platform located and operating in Zibo City of China’s Shandong Province.

Issuer:	Zibo Caijin Holding Group Co., Ltd.
LoC issuer:	Postal Savings Bank of China Co., Ltd., Zibo Branch
Amount:	RMB 580 million
Issue:	Credit enhanced bonds
Maturity:	Sept. 20, 2026
Bookrunners:	DL Securities, China Citic Bank International, Industrial Bank Co., Ltd., Hong Kong Branch, Guotai Junan International, Shenwan Hongyuan (H.K.), ABC International, Shanghai Pudong Development Bank Hong Kong Branch, SPDB International, Bocom International, CEB International, CNCB Capital, CMBC Capital, Carnegie Hill Capital Partners Ltd., Essence International and Zhongtai International
Trustee:	China Construction Bank (Asia) Corp., Ltd.
Coupon:	3.7%
Price:	Par
Yield:	3.7%
Call:	For taxation reasons at par plus interest
Puts:	At par plus interest for a change of control or no registration event
Pricing date:	Sept. 13
Issue date:	Sept. 20
Listing date:	Sept. 21
Distribution:	Regulation S
ISIN:	HK0000954104

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