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Published on 10/28/2021 in the Prospect News Emerging Markets Daily.

New Issue: China issues RMB 4.5 billion 2.41% bonds, RMB 1.5 billion 3.6% bonds

By Wendy Van Sickle

Columbus, Ohio, Oct. 28 – The People’s Republic of China through its Ministry of Finance issued an additional RMB 4.5 billion of 2.41% bonds due 2023 and RMB 1.5 billion of 3.6% bonds due 2028 through a competitive tender offer, according to a memorandum and a press release.

The 2.41% bonds will be consolidated and form a single series with the RMB 5 billion of 2.41% bonds (CMU Instrument No.: BCMKFB21002).

The 3.6% bonds will be consolidated and form a single series with the RMB 500 million of 3.6% bonds (CMU Instrument No.: BCMKFB13045).

The tender date was Oct. 20, and the issuance date was Oct. 22.

For the 2023 bonds, investors applied for RMB 10.072 billion of the bonds.

For the 2028 bonds, investors applied for RMB 3,218,500,000 of the bonds.

Bank of Communications Co., Ltd. Hong Kong Branch was the issuing and lodging agent.

Issuer:People’s Republic of China
Issue:Bonds
Amount:RMB 6 billion
Counsel to issuer:Linklaters (Hong Kong), Law Department of the Ministry of Finance (China)
Trade date:Oct. 20
Settlement date:Oct. 22
Distribution:Public
2023 bonds
Amount:RMB 4.5 billion
Maturity:Sept. 27, 2023
Coupon:2.41%
Price:99.82 to 100.78; average price 99.93
Issue number:BCMKFB21002
2028 bonds
Amount:RMB 1.5 billion
Maturity:June 27, 2028
Coupon:3.6%
Price:105.1 to 109.97; average price 105.47

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