By William Gullotti
Buffalo, N.Y., Sept. 2 – Yancheng High-Tech Zone Investment Group Co. Ltd. announced an application to list $115 million of 2.08% credit-enhanced bonds due 2024, according to a notice Thursday.
The bonds feature an irrevocable standby letter of credit issued by Bank of Jangsu Co., Ltd., Yancheng Branch.
Fosun Hani, AMC Wanhai Securities, Industrial Bank Co., Ltd., Hong Kong Branch, Luso Bank Ltd., Shanghai Pudong Development Bank Hong Kong Branch, Wilson Securities and Dongxing Securities (Hong Kong) are the joint global coordinators, joint lead managers and joint bookrunners for the offering.
The Regulation S notes are expected to be listed on the Stock Exchange of Hong Kong Ltd. on Sept. 3.
The issuer provides wind power equipment industry investment, park infrastructure investment and other investment services.
Issuer: | Yancheng High-Tech Zone Investment Group Co. Ltd.
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Issue: | Credit-enhanced bonds
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Amount: | $115 million
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Maturity: | 2024
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Bookrunners: | Fosun Hani, AMC Wanhai Securities, Industrial Bank Co., Ltd., Hong Kong Branch, Luso Bank Ltd., Shanghai Pudong Development Bank Hong Kong Branch, Wilson Securities and Dongxing Securities (Hong Kong)
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Coupon: | 2.08%
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Pricing date: | Aug. 30
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Listing date: | Sept. 3
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