Advanced Semiconductor plans NT$16.5 billion overseas convertibles

By Marisa Wong

Morgantown, W.Va., April 1 – Advanced Semiconductor Engineering, Inc. plans to issue the equivalent of up to NT$16.5 billion of overseas convertible bonds, according to a Taiwan Stock Exchange notice.

The issue price will be at least 80, and the coupon will be 0% to 5%.

Proceeds will be used for capital expenditures, repayment of bank loans and investments.

The company provides semiconductor packaging and test services and is based in Kaoshiung, Taiwan.

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