New Issue: China Beidahuang Industry sells HK$10 million 0.02% bonds due 2037

By Marisa Wong

Morgantown, W.Va., March 25 – China Beidahuang Industry Group Holdings Ltd. issued HK$10 million of 0.02% bonds due 2037 on Monday, according to a notice.

The bonds were issued under the company’s HK$300 million bond program established in May 2018. Apastron Capital Ltd. is the arranger of the program.

The bonds are callable on April 26, 2027 and putable from April 26, 2026 until April 26, 2027.

Issuer:	China Beidahuang Industry Group Holdings Ltd.
Issue:	Bonds
Amount:	HK$10 million
Maturity:	2037
Coupon:	0.02%
Call:	April 26, 2027
Put option:	From April 26, 2026 to April 26, 2027
Settlement date:	March 25

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