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Stats ChipPAC draws $150 million under credit facility to repay bonds
By Sara Rosenberg
New York, July 19 - Stats ChipPAC Ltd. drew down $150 million under its credit facility to repay all $150 million of its 7.5% senior notes that matured on Monday, according to a news release.
Stats ChipPAC is a Singapore-based service provider of semiconductor packaging design, assembly, test and distribution solutions.
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