Published on 3/20/2019 in the Prospect News Structured Products Daily.
New Issue: HSBC prices $2.29 million buffered AMPS due 2023 linked to S&P 500
By Sarah Lizee
Olympia, Wash., March 20 – HSBC USA Inc. priced $2.29 million of 0% buffered Accelerated Market Participation Securities due March 21, 2023 tied to the S&P 500 index, according to a 424B2 filing with the Securities and Exchange Commission.
The payout at maturity will be par plus 1.4 times any index gain, up to a maximum return of 75%.
Investors will receive par if the index falls by up to 20% and will lose 1.25% for each 1% decline beyond 20%.
HSBC Securities (USA) Inc. is the agent.
Issuer: | HSBC USA Inc.
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Issue: | Buffered Accelerated Market Participation Securities
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Underlying index: | S&P 500 index
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Amount: | $2,285,000
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Maturity: | March 21, 2023
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Coupon: | 0%
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Price: | Par
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Payout at maturity: | Par plus 1.4 times any index gain, capped at 75%; par if index falls by up to 20%; 1.25% loss for each 1% decline beyond 20%
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Initial level: | 2,832.94
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Pricing date: | March 18
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Settlement date: | March 21
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Agent: | HSBC Securities (USA) Inc.
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Fees: | 0.25%
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Cusip: | 40435UJR6
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