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Hiap Teck Venture seeks OK from commission to issue convertible bonds
By Marisa Wong
Madison, Wis., Oct. 4 - Hiap Teck Venture Bhd. plans to issue convertible bonds, according to an announcement by Hong Leong Investment Bank Bhd.
An application for the proposed bond issue has already been submitted to the Malaysia Securities Commission for approval.
Hiap Teck is a Klang, Malaysia-based steel company.
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