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Hiap Teck to sell up to RM 180 million of seven-year convertibles
By Marisa Wong
Madison, Wis., Jan. 28 - Hiap Teck Venture Bhd. plans to issue up to RM 180 million of seven-year redeemable convertible secured bonds, according a Hong Leong Investment Bank Bhd. announcement.
The bonds will be issued on a bought-deal or private placement basis.
The coupon and pricing details are yet to be determined.
Hiap Teck is a Klang, Malaysia-based steel company.
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