ABB €650 million note offering hinges on market conditions

By Paul A. Harris

St. Louis, Oct. 28 - ABB Ltd.'s planned €650 million ($750 million) bond offer hinges on conditions in the financial markets, according to a high yield market source and information released by the company.

Underwriters on the Swiss engineering firm's planned deal will be Barclays Capital, Deutsche Bank Securities and HVB, according to the high yield source.

Proceeds will be used to adjust the firm's debt repayment schedule.

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