By Marisa Wong
Madison, Wis., April 20 – E.Sun Bank priced NT$5 billion of subordinate financial debentures in two tranches, according to an announcement by parent company E.Sun Financial Holding Co., Ltd.
Tranche A consists of NT$500 million of 1.8% seven-year bonds, and tranche B consists of NT$4.5 billion of 2.1% 10-year bonds.
Both tranches will be issued at par on April 30.
Proceeds will be used to strengthen the company’s capital structure and enhance the BIS ratio.
This is the Taipei, Taiwan-based bank’s first issue of subordinate financial debentures for 2015.
| Issuer: | E.Sun Bank
|
| Issue: | Subordinate financial debentures
|
| Amount: | NT$5 billion
|
| Pricing date: | April 20
|
| Settlement date: | April 30
|
|
|
| Tranche A
|
| Amount: | NT$500 million
|
| Maturity: | April 30, 2022
|
| Coupon: | 1.8%
|
| Price: | Par
|
| Yield: | 1.8%
|
|
|
| Tranche B
|
| Amount: | NT$4.5 billion
|
| Maturity: | April 30, 2025
|
| Coupon: | 2.1%
|
| Price: | Par
|
| Yield: | 2.1%
|
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