By Marisa Wong
Madison, Wis., Aug. 16 - E.Sun Bank priced NT$8 billion of subordinate financial debentures in two tranches, according to an announcement by parent company E.Sun Financial Holding Co., Ltd.
Tranche A consists of NT$4.5 billion of 1½% bonds due Aug. 27, 2019, and tranche B consists of NT$3.5 billion of 1.62% bonds due Aug. 27, 2022.
Both tranches will be issued at par on Aug. 27.
Proceeds will be used to strengthen the company's capital structure and enhance the BIS ratio.
This is E.Sun's third series of subordinate financial debentures for 2012. The Taipei, Taiwan-based bank previously issued NT$2.28 billion of 1.58% bonds due 2019 and NT$2.72 billion of 1.68% bonds due 2022. The first issue of seven-year debentures settled on April 27, and the second issue of 10-year debentures settled on June 28.
| Issuer: | E.Sun Bank
|
| Issue: | Subordinate financial debentures
|
| Amount: | NT$8 billion
|
| Settlement date: | Aug. 27
|
|
|
| Tranche A
|
| Amount: | NT$4.5 billion
|
| Maturity: | Aug. 27, 2019
|
| Coupon: | 1½%
|
| Price: | Par
|
| Yield: | 1½%
|
|
|
| Tranche B
|
| Amount: | NT$3.5 billion
|
| Maturity: | Aug. 27, 2022
|
| Coupon: | 1.62%
|
| Price: | Par
|
| Yield: | 1.62%
|
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