By Marisa Wong
Madison, Wis., May 11 - E.Sun Bank priced NT$2.1 billion of 1.73% subordinate financial debentures due May 24, 2018 at par, according to an announcement by parent company E.Sun Financial Holding Co., Ltd.
This is the bank's first issue of subordinate financial debentures in 2011. The bonds will be issued on May 24.
Proceeds will be used to strengthen the bank's capital structure and enhance the BIS ratio.
The bank is based in Taipei, Taiwan.
| Issuer: | E.Sun Bank
|
| Issue: | Subordinate financial debentures
|
| Amount: | NT$2.1 billion
|
| Maturity: | May 24, 2018
|
| Coupon: | 1.73%
|
| Price: | Par
|
| Yield: | 1.73%
|
| Settlement date: | May 24
|
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