China’s Semiconductor Manufacturing plans offering of dollar bonds

By Toni Weeks

San Luis Obispo, Calif., Sept. 16 – Semiconductor Manufacturing International Corp. said it plans to conduct an international offering of U.S. dollar-denominated bonds with professional investors.

Joint lead managers Deutsche Bank AG, Singapore Branch and J.P. Morgan Securities plc will price the Rule 144A and Regulation S deal through a book building exercise, according to a company announcement.

Proceeds will be used for debt repayment, capital expenditures for capacity expansion associated with eight-inch and 12-inch manufacturing facilities and general corporate purposes.

The Shanghai company is a semiconductor foundry, providing integrated circuit foundry and technology services at 0.35-micron to 28-nanometer.

© 2015 Prospect News.
All content on this website is protected by copyright law in the U.S. and elsewhere. For the use of the person downloading only.
Redistribution and copying are prohibited by law without written permission in advance from Prospect News.
Redistribution or copying includes e-mailing, printing multiple copies or any other form of reproduction.