Advanced Semiconductor plans NT$9 billion overseas convertibles

By Marisa Wong

Madison, Wis., May 2 - Advanced Semiconductor Engineering, Inc. said its board of directors has resolved to issue up to NT$9 billion of overseas convertible bonds.

The issue price will be at least 80% of par.

Proceeds will be used for capital expenditure, growing operating capital, repaying debt and investments.

The company provides semiconductor packaging and test services and is based in Kaoshiung, Taiwan.

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